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intel is taking the lead with its advanced packaging glass substrate project, which has an investment scale of more than us$1 billion and will promote its goal of integrating one trillion transistors on a single package. samsung is also following suit, actively deploying glass substrates, and plans to officially mass produce in 2026. sk hynix and nvidia have also joined the glass substrate camp, and their roadmaps show that glass substrates will play an important role in chip production.
the emergence of glass substrates will completely change the way chips are packaged. it overcomes the warping problem of ceramic substrates and has stronger electrical performance, which brings new possibilities for chip manufacturing. the strong processability of glass substrates allows for higher precision and higher density packaging, which also means smaller chip size, higher storage capacity and more powerful computing power.
however, the road to commercialization of glass substrates has not been smooth sailing. processing, manufacturing testing and cost control are key challenges facing the development of glass substrates. the industry generally believes that the market penetration of glass substrates is slow, but with technology accumulation and industrial chain integration, glass substrates will occupy an important position in the next few years.
advantages of glass substrates:
glass substrate challenges:
despite the challenges, glass substrates still have huge potential. with the continuous advancement of technology and the integration of the industrial chain, glass substrates will become an indispensable force in the chip field and bring new development opportunities to chip manufacturing.